AMD GPU Appears to Leave Room for Future 3D V-Cache

Semiconductor engineer Tom Wassick has discovered what he believes to be 3D V-Cache functionality on one of AMD’s best GPUs, the RX 7900 XT. The engineer took a peak inside the 7900 XT’s die with infrared imaging and found the same type of 3D V-Cache connection points used on AMD’s Zen 3 and Zen 4 architecture. Wassick spotted the connections on the MCD die. 

Wassick cannot say if these TSV connection points will be used for caching purposes specifically, but AMD has made no known plans to expand its 3D packaging capabilities beyond vertically stacked cache at this point. That makes it seem like these connection points would be used with some sort of 3D cache in mind to increase gaming performance and/or compute performance. 

Source link